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Market News: NVIDIA has increased its recruitment in China, focusing on artificial intelligence to drive cars.Lan Foan met with World Trade Organization Director-General Ivira. On December 9, 2024, Minister Lan Foan met with World Trade Organization Director-General Ivira in Beijing. The two sides exchanged views on enhancing the transparency of subsidy policy, supporting the operation of global trust funds and maintaining the multilateral trading system.This year, the amount of M&A transactions involving listed companies in Hong Kong has reached 38 billion US dollars, which has triggered a rare bidding war. This year is expected to be the busiest year for M&A transactions involving listed companies in Hong Kong in the past decade, with industries ranging from skin care products to logistics real estate, and the bidding war has also warmed up. It is reported that China Mobile's bid for Hongkong Broadband may face competition from American private equity firm I Squared Capital. Bi Hua, chairman of Fenmei Packaging, is negotiating with Qihao Capital to jointly counter the privatization offer of Shandong Xinjufeng. The data shows that the scale of M&A transactions for listed companies in Hong Kong has reached $38 billion this year, the highest level since 2017, including the merger of Guotai Junan Securities and Haitong Securities, a smaller competitor, to become the largest brokerage firm in China.

Noon announcement: Southeast Power Grid won the bid for the 489 million yuan smart logistics eHub project in Hangzhou, ① China Green Power: obtaining the 200,000 kW wind power construction index in Guizhou. The projects of "duyun city Pingshan Wind Farm" and "duyun city Tudizhai Wind Farm" declared by Shaanxi Branch of Luneng New Energy (Group) Co., Ltd., a subsidiary of the company, were included in the "Guizhou Province 2024 Wind Power Photovoltaic Power Generation Construction Scale Project Plan (the third batch)". The acquisition of the above new energy construction indicators is conducive to enriching the company's new energy project reserves. ② Tianyoude Liquor: Decided to carry out activities to invite shareholders to taste products. As of the company's closing on the afternoon of January 19, June 6 and August 13, 2024, shareholders who have registered in Shenzhen Branch of Zhongdeng Company and hold shares in the company can participate in the following activities after successful registration: shareholders can enjoy a 50% discount coupon, and as a general prize, each shareholder can get one, and they can buy products in the shareholder area; One shareholder tasting of Tianyoude Liquor, totaling 3,500 copies, was selected from the number of successful applicants. ③ Tailin Bio: Only the last half trading day is left before the "Tailin Convertible Bonds" stops converting shares, that is, the afternoon trading session on December 12. After the market closes on December 12th, the "Tailin Convertible Bonds" that have not been converted into shares will stop conversion, and the remaining convertible bonds will be forcibly redeemed at the price of 101.15 yuan per share. If forced to redeem, investors may face investment losses. ④ Southeast grid: The company recently received the Notice of Winning Bid from Zhejiang Airport International Logistics Supply Chain Co., Ltd., and determined that the company was the winning bidder of "Global Smart Logistics Hub Hangzhou eHub Project (Distribution Warehouse)", with a total winning bid of 489 million yuan, accounting for 3.76% of the company's annual operating income in 2023, and the project duration was 730 days.Pakistan KSE-100 Index rose 2% to 113,268.80.Citigroup slightly lowered South Korea's GDP growth forecast to 1.5% next year. It is expected that the Bank of Korea will cut interest rates next month. Citigroup released a report saying that considering the worse economic sentiment in South Korea this month, it slightly lowered its GDP forecast for this year and next year by 0.1 percentage point to 2.1% and 1.5% respectively. The bank slightly lowered Korea's GDP growth forecast for the last quarter of this year by 0.1 percentage point to rise by 0.3% quarterly, and raised its GDP growth forecast for the first quarter of next year by 0.1 percentage point to rise by 0.6% quarterly. Looking forward to the first quarter of next year, the bank expects South Korea to adopt a combination of expansionary policies, including the Bank of Korea's expected interest rate cut to 2.75% in mid-January, and the government's expected additional budget of 30 trillion won (equivalent to about 1.1% of GDP next year). It is expected that the Bank of Korea will cut interest rates by 25BP each in January, April, July and October next year, and the final interest rate is expected to be 2%.

The USD/JPY rose more than 30 points against the Japanese yen in the short term and is now reported at 152.56.An earthquake of magnitude 4.0 occurred in the waters near the Fukushima Daiichi nuclear power plant in Japan. According to Japanese media reports, an earthquake of magnitude 4.0 occurred on the morning of the 12th local time in the eastern coastal area of Fukushima Prefecture, Japan, with a focal depth of 50 kilometers. Fukushima Prefecture has a sense of earthquake in many places, including Urachi-CHO, Langjiang-CHO and Yuye-CHO, among which Urachi is the location of Units 1 to 4 of the Fukushima Daiichi nuclear power plant. (CCTV News)Intel: Breakthrough progress has been made in chip interconnection, and the inter-line capacitance has been reduced by 25%. Recently, Intel OEM announced a major breakthrough in on-chip interconnection technology. The latest subtractive Ruthenium interconnection technology of the company can reduce the inter-line capacitance by up to 25%, effectively improving the on-chip interconnection. According to reports, the subtractive ruthenium interconnection technology has achieved great progress in interconnection miniaturization by using ruthenium, a new, key and alternative metallization material, and using thin film resistivity and airgap. This process does not need an expensive photolithographic air gap exclusion zone around the via, and it can also avoid using a self-aligned via that is selectively etched. When the spacing is less than or equal to 25 nm, the air gap realized by reducing ruthenium interconnection technology can reduce the capacitance between lines by up to 25%, which can be used as a metallization scheme to replace copper damascene process in closely spaced layers. It is reported that this solution is expected to be applied in the future process nodes of Intel OEM. (Sina Technology)